Information processing device and manufacturing method of the information processing device

ABSTRACT

An information processing device includes a housing part; a heating part arranged in the housing part; a cooling unit configured to cool the heating part; an airflow supplying member configured to supply an airflow to the cooling unit; and an airflow limitation member configured to limit the airflow supplied by the airflow supplying member. A part of the cooling unit, the airflow limitation member, and the airflow supplying member are arranged in series. An air intake part is provided in one surface of the housing part so as to intake air into the airflow limitation member. An air discharge part is provided in another surface of the housing part so as to discharge air cooling the part of the cooling unit. An air discharge unit is provided at an air discharge opening provided at one side surface of the airflow limitation member.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Division of and claims the benefit priority fromU.S. Ser. No. 11/536,217, filed Sep. 28, 2006, which claims the benefitof priority from Japanese Patent Application No. 2005-310548, filed Oct.25, 2005, the entire contents of each of which are incorporated hereinby reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to information processingdevices and manufacturing methods of the information processing devices,and more particularly, an information processing device having a coolingmechanism for a heating part such as a CPU (Central Processing Unit) anda manufacturing method of the information processing device.

2. Description of the Related Art

Accompanying the spread of the Internet and improvement in CPUs (CentralProcessing Unit) and the like, a process such as image processing ormotion picture processing is frequently performed by using a personalcomputer or a computer made exclusively for the process. Such a processplaces a heavy workload on the CPU.

Although performance of the CPU is being improved day by day, if theprocess for placing the heavy workload on the CPU is continuouslyperformed, the CPU is heated so as to have a high temperature. Thiscauses degradation of the performance of the CPU.

In addition, as the performance of the CPU is improved and the CPU worksat a low voltage, consumption of electrical current in the CPU isincreased. This causes an increase of temperature of a power controlelement for supplying electric power to the CPU.

In order to solve the above-discussed problem, Japanese Laid-Open PatentApplication Publication No. 2003-108269 discloses the followingstructure for cooling of electronic parts. That is, a high temperaturearea contains a CPU, a chip set, a memory, and a graphic board. A lowtemperature area contains a power supply and drives for driving anexternal storage medium. The temperature areas are separated by apartition wall. The high temperature area is cooled by a CPU coolingfan, a heat sink and an additional fan, and the low temperature area iscooled by a power supply fan. The partition wall is formed by a riserboard and a riser bracket.

However, in the technique disclosed in Japanese Laid-Open PatentApplication Publication No. 2003-108269, there is limitation of lay-outwhen an electronic component is mounted on an SMT (Surface MountTechnology) board. Hence, design freedom of a surface mount design islost. In addition, Japanese Laid-Open Patent Application Publication No.2003-108269 does not discuss how hot air dispersed by a CPU cooling fanis discharged to the outside of the computer.

Furthermore, the power control element requires controlling a largeamount of electric current. For example, approximately 100 A may berequired for the operation of recent CPUs. Such a power control elementmay be required to be arranged in the vicinity of the CPU so that thereis little influence of impedance of a wiring pattern. Effective heattransfer from these elements may be required.

SUMMARY OF THE INVENTION

Accordingly, embodiments of the present invention may provide a noveland useful information processing device and manufacturing method of theinformation processing device in which the above-mentioned problems areeliminated.

More specifically, the embodiments of the present invention may provide

an information processing device having a cooling mechanism for aheating part such as a CPU (Central Processing Unit) or a power controlelement whereby hot air is securely discharged from inside of a housingpart of the information processing device without loss of design freedomof a board mounting process and a manufacturing method of theinformation processing device.

The embodiments of the present invention may provide an informationprocessing device, including a housing part; a heating part arranged inthe housing part; a cooling unit configured to cool the heating part; anairflow supplying member configured to supply an airflow to the coolingunit; and an airflow limitation member configured to limit the airflowsupplied by the airflow supplying member; wherein a part of the coolingunit, the airflow limitation member, and the airflow supplying memberare arranged in series; an air intake part is provided in one surface ofthe housing part so as to intake air into the airflow limitation member;an air discharge part is provided in another surface of the housing partso as to discharge air cooling the part of the cooling unit; and an airdischarge unit is provided at an air discharge opening provided at oneside surface of the airflow limitation member.

An air filter may be provided at the air discharge opening provided atthe side surface of the airflow limitation member. The housing part mayinclude a second air intake part different from the air intake part anda second air discharge part different from the air discharge part; andheat generated at the heating part and a part other than the hearingpart may be discharged from the second discharge part to an outside ofthe housing part. The airflow limitation member may include a notchpart; and the airflow supplying member or the cooling unit and a bottomsurface of the airflow limitation member may not come in contact witheach other when the airflow limitation member is installed. A coolingunit fixing part may be provided so as to fix a part of the coolingunit; and the cooling unit fixing part may include a receiving part as alid for a notch part provided at the airflow limitation member. Theairflow supplying member may have a structure where an internal diameterat a side of the air intake part is larger than an internal diameter ata side of the air discharge part.

The embodiments of the present invention may also provide an informationprocessing device, including: a housing part; a heating part arranged inthe housing part; a cooling unit configured to cool the heating part; anairflow supplying member configured to supply an airflow to a part ofthe cooling unit; and an airflow limitation member configured to limitthe airflow supplied by the airflow supplying member; wherein an airintake part is provided in one surface of the housing part so as tointake air into the airflow limitation member; an air discharge part isprovided in another surface of the housing part so as to discharge aircooling the part of the cooling unit; the airflow limitation memberincludes a duct main body and a supplemental duct; the duct main bodyand the part of the cooling unit are arranged in series; and thesupplemental duct is connected to an air discharge opening provided atone side surface of the airflow limitation member.

The embodiments of the present invention may also provide an informationprocessing device, including a housing part; a heating part arranged inthe housing part; a cooling unit configured to cool the heating part; anairflow supplying member configured to supply an airflow to a part ofthe cooling unit; and an airflow limitation member configured to limitthe airflow supplied by the airflow supplying member; wherein an airintake part is provided in one surface of the housing part so as tointake air into the airflow limitation member; an air discharge part isprovided in another surface of the housing part so as to discharge aircooling the part of the cooling unit; the airflow limitation memberincludes a duct main body and a supplemental duct; the duct main bodyand the part of the cooling unit are arranged in series; and thesupplemental duct is connected to an air discharge opening provided atone side surface of the airflow limitation member and an air filter isprovided at the air discharged opening.

The embodiments of the present invention may also provide amanufacturing method of an information processing device, theinformation processing device, including: a housing part; a heating partarranged in the housing part; a cooling unit configured to cool thehearing part; an airflow supplying member configured to supply anairflow to the cooling unit; and an airflow limitation member configuredto limit the airflow supplied by the airflow supplying member; wherein apart of the cooling unit, the airflow limitation member, and the airflowsupplying member are arranged in series; an air intake part is providedin one surface of the housing part so as to intake air into the airflowlimitation member; an air discharge part is provided in another surfaceof the housing part so as to discharge air cooling the part of thecooling unit; and an air discharge unit is provided at an air dischargeopening provided at one side surface of the airflow limitation member;the manufacturing method comprising the steps of: providing the heatingpart in the housing part; providing the part of the cooling unitconfigured to cool the heating part and the airflow supplying memberconfigured to supply the airflow to the part of the cooling unit, in acooling unit fixing part having a receiving part; contacting other partof the cooling unit and the heating part; providing the airflowlimitation member having a structure where a designated notch part isprovided at a side contacting the cooling unit fixing part by rotatingthe airflow limitation member where a fulcrum of the rotation isprovided at a side opposite to a side where the notch part is provided;and covering the notch part of the airflow limitation member with thereceiving part of the cooling unit fixing part.

The embodiments of the present invention may also provide amanufacturing method of an information processing device, theinformation processing device including: a housing part; a heating partarranged in the housing part; a cooling unit configured to cool thehearing part; an airflow supplying member configured to supply anairflow to a part of the cooling unit; and an airflow limitation memberconfigured to limit the airflow supplied by the airflow supplyingmember; wherein an air intake part is provided in one surface of thehousing part so as to intake air into the airflow limitation member; anair discharge part is provided in another surface of the housing part soas to discharge air cooling the part of the cooling unit; the airflowlimitation member includes a duct main body and a supplemental duct; theduct main body and the part of the cooling unit are arranged in series;and the supplemental duct is connected to an air discharge openingprovided at one side surface of the airflow limitation member; themanufacturing method including the steps of: providing the heating partin the housing part; providing the part of the cooling unit configuredto cool the heating part and the airflow supplying member configured tosupply the airflow to the part of the cooling unit, in a cooling unitfixing part having a receiving part; contacting another part of thecooling unit and the heating part; providing the airflow limitationmember having a structure where a designated notch part is provided at aside contacting the cooling unit fixing part by rotating the airflowlimitation member where a fulcrum of the rotation is provided at a sideopposite to a side where the notch part is provided; and covering thenotch part of the airflow limitation member with the receiving part ofthe cooling unit fixing part.

According to the embodiments of the present invention, it is possible tocool the heating part and securely discharge hot air from inside thehousing part of the information processing device without losing thedesign freedom of the board mounting process.

Other objects, features, and advantages of the present invention willbecome more apparent from the following detailed description when readin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an information processing device where acooling mechanism of the present invention is applied;

FIG. 2 is a perspective view showing an appearance of the inside of ahousing part of the information processing device having a CPU coolingunit;

FIG. 3 is a perspective view of the CPU cooling unit used in theinformation processing device shown in FIG. 1;

FIG. 4 is a view showing a notch part of a duct and an air dischargeopening for cooling a printed circuit board used in the informationprocessing device shown in FIG. 1;

FIG. 5 is a perspective view showing the appearance of a CPU coolingunit fixing part used in the information processing device shown in FIG.1;

FIGS. 6(A) and (B) are views showing another example of the duct used inthe information processing device shown in FIG. 1;

FIG. 7 is a perspective view showing the appearance of the inside of ahousing part where a print circuit board cooling fan is provided of theembodiment of the present invention;

FIG. 8 is a perspective view showing a structure of the duct of theembodiment of the present invention;

FIG. 9 is a structure explanation view for showing an example of thearrangement of the embodiment shown in FIG. 8;

FIG. 10 is a perspective view of a duct of another embodiment of thepresent invention;

FIG. 11 is a view showing airflow and the structure of a duct of theembodiment shown in FIG. 10;

FIG. 12 is a schematic diagram showing an airflow and the structure of aduct of another embodiment of the present invention; and

FIG. 13 is a schematic diagram showing airflow and the structure of aduct of another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A description of the present invention is now given, with reference toFIG. 1 through FIG. 13, including embodiments of the present invention.FIG. 1 through FIG. 6 are structural views for explaining an example ofan information processing device 1 where a cooling mechanism of thepresent invention is applied. FIG. 7 through FIG. 13 are concretestructural views of the cooling mechanism of the embodiments of thepresent invention.

FIG. 1 is a perspective view of the information processing device 1where the cooling mechanism of the present invention is applied.

The information processing device 1 includes an upper part cover 2 and afan installing part 3. The upper part cover 2 forms a part of a housingpart. A fan for cooling the inside of the housing part is contained inthe fan installing part 3.

A first air intake part 10 and a second air intake part 8 having a largenumber of air intake holes are provided in a front surface cover 4 ofthe information processing device 1. Filters are provided at rearsurfaces of the first air intake part 10 and the second air intake part8 so that foreign particles are prevented from being introduced into thehousing part. In addition, a five-inch removable battery unit 5, USB(Universal Serial Bus) terminals 6 and 7, a floppy disk (registeredtrademark) drive 9, five-inch optical disk drives 11 and 12, and aelectric power switch 13 are provided at the front surface cover 4.

FIG. 2 is a perspective view showing the appearance of the inside of ahousing part of the information processing device having a CPU coolingunit. More specifically, FIG. 2 shows a state where the upper part cover2 and the front surface cover 4 are removed from the informationprocessing device 1 shown in FIG. 1. In FIG. 2, parts that are the sameas the parts shown in FIG. 1 are given the same reference numerals.

Referring to FIG. 2, the information processing device 1 (100) has3.5-inch hard disk drives 15 and 16. In addition, a mother board 17 isprovided along a side surface of the housing body. A CPU, a memory andthe like are provided on the mother board 17. The information processingdevice 1 (100) has an electric power unit 23 having a generic ATXspecification. A fan (not shown in FIG. 2) is installed in the electricpower unit 23. In addition, the information processing device 1 (100)has an expansion card pressure foot 22 for installing an expansion cardin an expansion slot of the mother board 17. In the fan installing part3, a fan having a size of 80 mm such as a product code D08A (not shownin FIG. 2) made by NIDEC Corporation is installed.

Air taken in from the second air intake part 8 shown in FIG. 1 is takeninside of the information processing device via a second lattice 14. Theair taken in from the second air intake part 8 is heated by electronicdevices or electric devices provided inside of the informationprocessing device 1 (100) and discharged by the fan installed in the faninstalling part 3 and the fan of the electric power unit 23. Under thisstructure, heat generated by various drives 9, 11, 12, 15 and 16, thebattery unit 5, electronic components (heating part) mounted on themother board 17, and the electric power unit (heating part) 23 can betransferred to the outside of the information processing device 1 (100).A part of heat generated by the CPU (heating part) is also transferredto the outside of the information processing device 1 (100) by the faninstalled in the fan installing part 3 and the fan of the electric powerunit 23.

The information processing device 1 (100) also has a duct 18, a CPUcooling fan (airflow supplying member) 20, and a CPU cooling unit fixingpart 21. The duct 18 is an airflow limitation member for air taken in bythe first air intake part 10 and passing through the first lattice 19pass. The duct 18 is made by sheet metal working and has a structurewhere the inside is a cavity. The CPU cooling fan 20 supplies airflow toa cooling unit. A fan having a size of 92 mm such as a product code9A0912F402 made by SANYO Electric Co. Ltd is used as the CPU cooling fan20. The CPU cooling unit fixing part 21 is provided at or in thevicinity of a rear surface of the housing body of the informationprocessing device 1. Plural holes are formed on the rear surface of thehousing body of the information processing device 1 corresponding to apart where the CPU cooling unit fixing part 21 is provided, so that theair passing through the CPU cooling unit fixing part 21 is discharged tothe outside.

Next, the CPU cooling unit is discussed with reference to FIG. 3. Here,FIG. 3 is a perspective view of the CPU cooling unit used in theinformation processing device shown in FIG. 1.

Referring to FIG. 3, a fin 24 is formed by 47 pieces of aluminum plates.Each of the aluminum plates has a size of 95 mm×50 mm and a thickness of0.3 mm. The fin 24 is cooled by the CPU cooling fan (airflow supplyingmember) 20. Four pieces of heat pipes 25 are made of copper. Each of theheat pipes 25 is filled with water. The heat pipes 24 pierce a heatreceiving part 26 made of aluminum and the fin 24. The heat receivingpart 26 receives heat from the CPU (not shown in FIG. 3). Heat receivedby the heat receiving part 26 warms the heat pipes 25 so that water inthe heat pipes 25 is evaporated. Vapor in the heat pipes 25 is cooled bythe fin 24 and returned to the heat receiving part 26. In addition, heattransferred to the heat pipes 25 is transferred to the fin 24. Underthis structure, the heat generated by the CPU is dissipated.

FIG. 4 shows an end part of the duct 18. A notch part 18A is provided ata lower side of the end part of the duct 18. By the notch part 18A, itis possible to easily install the duct 18 in the information processingdevice 1. In other words, first, the CPU cooling fan (airflow supplyingmember) 20 and the CPU cooling unit fixing part 21 are provided in theinformation processing device 1. After that, the duct 18 is rotated in astate where a side of lattice 19 is a fulcrum of the rotation. In thiscase, since the notch part 18A is provided, the duct 18 can be providedin a designated position as shown in FIG. 2 without contacting the CPUcooling fan (airflow supplying member) 20 and the CPU cooling unitfixing part 21.

FIG. 5 is a perspective view showing the appearance of the CPU coolingunit fixing part 21 used in the information processing device shown inFIG. 1.

The CPU cooling unit fixing part 21 is made of ABS(acrylonitrile-butadiene-styrene copolymer) resin. The fin 24 for theCPU cooling unit is installed inside of the CPU cooling unit fixing part21. In addition, claws 21B are provided at four portions of the CPUcooling unit fixing part 21 so that the CPU cooling fan 20 can beattached. By hanging the CPU cooling fan 20 on the claws 21B, the CPUcooling fan 20 is attached to the CPU cooling unit fixing part 21.

The CPU cooling unit fixing part 21 also has a receiving part 21A. Thereceiving part 21A works as a cover of the notch part 18A, so that warmair can be prevented from being taken from the notch part 18A of theduct 18 or the inside of the information processing device 1 other thanthe duct 18 into the duct 18 or the CPU cooling fan 20.

In other words, the air taken in from the first air intake part 10passes through the duct 18 via the first lattice 19, enters the CPUcooling fan 20 and the CPU cooling unit fixing part 21 where heatgenerated by the CPU is indirectly removed, and is discharged from therear surface of the housing body.

Thus, since the duct 18, the CPU cooling fan 20, and the CPU coolingunit fixing part 21 are arranged in series, air resistance that is anobstacle to the airflow is not formed so that the air in the duct 18smoothly moves toward the fan 20 and the CPU can be efficiently cooled.

The information processing device 1 is manufactured by the followingprocesses.

First, a housing body having lattices 14 and 19 is prepared. Basiccomponents such as the mother board 17 where the CPU or the like isprovided, the electric power switch 13, the electric power unit 23, theUSB terminals 6 and 7 and the 80 mm cooling fan are provided in thehousing body.

Next, the removable battery unit 5 and the drives 9, 11, 12, 15 and 16are provided. The CPU cooling units 24, 25 and 26 and the CPU coolingfan 20 are provided in the CPU cooling unit fixing part 21, and then theCPU cooling unit fixing part 21 is provided in the housing body. At thistime, the CPU comes in contact with the heat receiving part 26 and bothof them are fixed in place with screws. After that, the duct 18 isinstalled as discussed above. Last, the upper part cover 2 is providedfor covering so that the information processing device 1 is completed.

Instead of the duct 18 having the same internal diameter along theentire longitudinal length, a duct with the structure shown in FIGS. 6Aand 6B may be used. Here, FIGS. 6A and 6B are plan views of ducts 180and 181. The duct 180 shown in FIG. 6(A) has a structure where the sizeof an air intake opening is changed so as to the same (linear) on theway. The duct 181 shown in FIG. 6(B) has a structure where the size ofan air intake opening is changed so as to be gradually narrowed. Underthis structure, it is possible to increase the amount of air that istaken in so that a cooling effect can be achieved.

In addition, air taken in from the second air intake part 8 can transferheat generated by mainly the drives 9, 11, 12, 15 and 16, the batteryunit 5, the electronic components mounted on the mother board 17, andthe electric power unit 23 to the outside. The air taken in from thefirst air intake part 10 can be exclusively for cooling the CPU.

Under this structure, electric devices generating a relatively smallamount of heat can be cooled by the fan installed in the fan installingpart 3 and the fan provided to the electric power unit 23. The CPUgenerating more heat than that of the other electronic devices can beefficiently cooled on a dedicated basis.

In addition, since the CPU cooling units 24, and 26 and the mother board17 are provided separately, it is possible to relatively freely mountthe electronic device on the mother board 17 in relation to the CPU.

The heat pipes 25 are filled with liquid such as water. Therefore, whenvapor is cooled so as to change to liquid, it is necessary to properlyreturn the liquid to the heat receiving part 26. Hence, the fin 24 isrequired to be provided in a position higher than the CPU. Accordingly,the duct 18, the CPU cooling fan 20, and the CPU cooling unit fixingpart 21 are arranged on an upper part of the information processingdevice 1. Under this structure, as long as the CPU is not provided atthe upper part of the housing body, it is possible to efficiently coolthe CPU. In addition, in a case where the CPU is arranged at a lowerpart of the housing body, the duct 18, the CPU cooling fan 20, and theCPU cooling unit fixing part 21 can be provided at a lower part.

In this embodiment, air passing through the duct 18 is used for coolingthe CPU. However, in a case where not only the CPU but also othercomponents or units generate high heat, for example a heating part suchas a chip set, are provided, such air may be used for cooling thesecomponents or unit. In this case, the heat receiving part 26 may bedivided into plural parts so as to contact these components or unit.Alternatively, a single heat receiving part 26 may come in contact withboth the CPU and other heating bodies concurrently. In addition, in acase where the increase of temperature of the CPU is not so large, airfrom the duct 18 may cool only other heating bodies.

Although air is taken in from the front surface of the informationprocessing device 1 and air is discharged from the rear surface of theinformation processing device 1, the present invention is not limited tothis. For example, air may be taken in from a side surface of theinformation processing device 1 and air may be discharged from anotherside surface of the information processing device 1. In other words, alimitation for preventing obstacles to the airflow may be made so thatair can be smoothly taken in or discharged.

In addition, although the duct 18 is formed by sheet metal working inthis embodiment, the present invention is not limited to this. Forexample, the duct 18 may be made of acrylonitrile-butadiene-styrenecopolymer resin. Furthermore, instead of the duct 18, a circularcylinder shaped pipe can be used. In other words, limitations forpreventing obstacles to airflow may be made so that air can be smoothlytaken in or discharge.

Furthermore, the 92 mm fan is used as the CPU cooling fan 20 and the 80mm fan is used as a cooling fan for cooling the entirety of theinformation processing device 1 in this embodiment. However, the presentinvention is not limited to this.

In addition, the floppy disk (registered trademark) drive 9, theremovable battery 5, the optical disk drives 11 and 12, and the harddisk drives 15 and 16 are provided in this embodiment. However, theseare optional and therefore there is no need to provide all of them.

Next, an embodiment of the present invention is discussed with referenceto FIG. 7 through FIG. 13. In FIG. 7 through FIG. 13, parts that are thesame as the parts shown in FIG. 1 through FIG. 6B are given the samereference numerals, and explanation thereof is omitted.

FIG. 7 is a view showing a structure of the information processingdevice having a cooling mechanism of the embodiment of the presentinvention. More specifically, FIG. 7 shows an internal structure wherethe upper part cover and the fort surface cover are removed.

In the cooling mechanism shown in FIG. 1 through FIG. 6B, since airtaken in from the first intake part 10 can be exclusively used forcooling the CPU, cooling the CPU 33 provided on the mother board 17 canbe sufficiently obtained. However, since the duct 18 forms a closedspace, the airflow to the heating components in the vicinity of the CPUcannot be obtained. Hence, it is necessary to improve this point.

In order to solve such a problem, in the structure shown in FIG. 7, theair discharge unit shown in FIG. 8 or FIG. 9 is provided at a sidesurface of the duct 18 so that cooling airflow to the electroniccomponent provided in the vicinity of the CPU is provided at the sametime of cooling the CPU 33.

FIG. 8 is a perspective view showing the appearance of an example of theair discharge unit (cooling unit) provided at the duct. FIG. 9 is a planview showing a state where the air discharge unit (cooling unit) isattached to the duct.

In this air discharge unit, an air discharging opening 18 a is providedat a side surface of the duct 18 for cooling the CPU 33 and the fan 34is provided at the air discharge opening 18 a. Under this structure,airflow for cooling the electric power control element in the vicinityof the CPU is sufficiently provided.

The mother board 17 that is a printed circuit board where the CPU ismounted is provided in a position facing the side surface of the duct 18where the air discharge unit is provided. The heating elements (heatingparts) 30, 31, and 32 and the CPU 33 are mounted on the mother board 17.The heat receiving part 26 contacting the CPU 33 is connected to the fin24 via the heat pipe 25.

In an example shown in FIG. 9, a part of air flow taken in from theoutside of the housing body via the first air intake part 10 and flowingin the duct 18 is directly led to a side of the mother board 17 via theair discharge unit such as the fan or blower provided at the airdischarge opening 18 a provided at the duct side surface so that theheating elements 30, 31 and 32 provided in the periphery of the CPU 33generating the largest amount of heat are cooled. The airflow dischargedfrom the air discharged opening 18 a situated at the side surface of theduct 18 is discharged to the outside of the housing body via theperiphery of the mother board 17 by the fan installed in the faninstalling part 3.

FIG. 10 and FIG. 11 show other examples of the structure of the airdischarge unit. The duct 18 has a duct main body 18-1 and a supplementalduct 18-2. The CPU 33 and the circuit elements 30, 31 and 32 provided inthe periphery of the CPU 33 can be cooled by air discharged from thesupplemental duct 18-2 via the air discharge opening 18 a. Thus, byproperly dividing and securing air flow of the duct main body 18-1 andthe supplemental duct 18-2, it is possible to improve the cooling effectof both the CPU 33 and the circuit elements 30, 31 and 32 provided inthe periphery of the CPU 33 without endangering the cooling effect ofthe CPU. As a method for forming the supplemental duct 18-2, the flowpath of the duct 18 may be divided into two parts or an individual ductmay be provided outside of the duct 18.

FIG. 12 shows a structure where the fan 34 is provided in the airdischarge opening 18 a of the duct 18 shown in FIG. 9 via an air filter29. The air filter 29 removes dust in the air flowing toward the motherboard 17. On the other hand, a cooling airflow of the CPU is supplied tothe heat radiation part not via the air filter 29 so as to be dischargedto the outside of the housing body.

By providing the air filters to the air intake opening and a sidesurface air discharge opening 18 a of the duct, it is possible to reducethe thickness of the air filters. Therefore, air resistance can bereduced when taking air into the duct so that both a cooling effect atthe side of the CPU and securing safety and reliability can be achieved.

It is preferable to remove the air filter 29 if only the cooling effectis considered. This is because while the air filter 29 prevents theentry of foreign particles, the amount and speed of airflow for coolingis reduced due to the air resistance of the air filter 29. However,since a minute foreign particle such as dust may be mixed in the airdirectly supplied from the air discharge opening 18 a to the heatingcomponents 30, 31 and 32, it is necessary to provide the air filter 29so that circuit elements are not damaged. In the structure shown in FIG.12, in a case where there is no electronic circuit part and air issupplied to the heat receiving part 26 that is a radiator for heatdissipation, there is little problem of mixture of dust. Hence, it issufficient to prevent the entry of foreign particles by punching a metalstate shield plate which is provided at the air intake opening of theduct 18.

FIG. 13 shows a structure where the fan 34 is arranged at the airdischarge opening 18 a of the supplemental duct 18-2 shown in FIG. 11via the air filter 29. In a case where the supplemental duct 18-2 isprovided separately from the duct main body 18-1, the air filter of theduct at a side of the heat receiving part 26 can be omitted by providingthe air filter 29 at the air discharge opening 18 a or the air intakeopening of the supplemental duct 18-2 at a side where air is supplied tothe circuit components 30, 31 and 32. As a result of this, it ispossible to improve the cooling effect at the CPU.

The present invention is not limited to these embodiments, butvariations and modifications may be made without departing from thescope of the present invention.

This patent application is based on Japanese Priority Patent ApplicationNo. 2005-310548 filed on Oct. 25, 2005, the entire contents of which arehereby incorporated by reference.

1. An information processing device, comprising: a housing part; aheating part arranged in the housing part; a cooling unit configured tocool the heating part; an airflow supplying member configured to supplyan airflow to a part of the cooling unit; and an airflow limitationmember configured to limit the airflow supplied by the airflow supplyingmember; wherein an air intake part is provided in one surface of thehousing part so as to intake air into the airflow limitation member; anair discharge part is provided in another surface of the housing part soas to discharge air cooling the part of the cooling unit; the airflowlimitation member includes a duct main body and a supplemental duct; theduct main body and the part of the cooling unit are arranged in series;and the supplemental duct is connected to an air discharge openingprovided at one side surface of the airflow limitation member.
 2. Aninformation processing device, comprising: a housing part; a heatingpart arranged in the housing part; a cooling unit configured to cool theheating part; an airflow supplying member configured to supply anairflow to a part of the cooling unit; and an airflow limitation memberconfigured to limit the airflow supplied by the airflow supplyingmember; wherein an air intake part is provided in one surface of thehousing part so as to intake air into the airflow limitation member; anair discharge part is provided in another surface of the housing part soas to discharge air cooling the part of the cooling unit; the airflowlimitation member includes a duct main body and a supplemental duct; theduct main body and the part of the cooling unit are arranged in series;and the supplemental duct is connected to an air discharge openingprovided at one side surface of the airflow limitation member and an airfilter is provided at the air discharged opening.
 3. A manufacturingmethod of an information processing device, the information processingdevice including: a housing part; a heating part arranged in the housingpart; a cooling unit configured to cool the hearing part; an airflowsupplying member configured to supply an airflow to a part of thecooling unit; and an airflow limitation member configured to limit theairflow supplied by the airflow supplying member; wherein an air intakepart is provided in one surface of the housing part so as to intake airinto the airflow limitation member; an air discharge part is provided inanother surface of the housing part so as to discharge air cooling thepart of the cooling unit; the airflow limitation member includes a ductmain body and a supplemental duct; the duct main body and the part ofthe cooling unit are arranged in series; and the supplemental duct isconnected to an air discharge opening provided at one side surface ofthe airflow limitation member; the manufacturing method comprising thesteps of: providing the heating part in the housing part; providing thepart of the cooling unit configured to cool the heating part and theairflow supplying member configured to supply the airflow to the part ofthe cooling unit, in a cooling unit fixing part having a receiving part;contacting another part of the cooling unit and the heating part;providing the airflow limitation member having a structure where adesignated notch part is provided at a side contacting the cooling unitfixing part by rotating the airflow limitation member where a fulcrum ofthe rotation is provided at a side opposite to a side where the notchpart is provided; and covering the notch part of the airflow limitationmember with the receiving part of the cooling unit fixing part.
 4. Theinformation processing device as claimed in claim 1, wherein the housingpart includes a second air intake part different from the air intakepart and a second air discharge part different from the air dischargepart; and heat generated at the heating part and a part other than theheating part is discharged from the second air discharge part to anoutside of the housing part.
 5. The information processing device asclaimed in claim 1, wherein the airflow limitation member includes anotch part; and the airflow supplying member or the cooling unit and abottom surface of the airflow limitation member do not come in contactwith each other when the airflow limitation member is installed.
 6. Theinformation processing device as claimed in claim 1, wherein a coolingunit fixing part is provided so as to fix a part of the cooling unit;and the cooling unit fixing part includes a receiving part as a lid fora notch part provided at the airflow limitation member.
 7. Theinformation processing device as claimed in claim 1, wherein the airflowsupplying member has a structure where an internal diameter at a side ofthe air intake part is larger than an internal diameter at a side of theair discharge part.